Paul Pickle was appointed president and chief operating officer (COO) of Microsemi Corporation in November 2013 and is responsible for overseeing all company operations, marketing and sales, as well as its research and development efforts. He also plays a key leadership role in defining the strategic direction for the company. Prior to this position, he served as executive vice president, leading business operations of the company’s Integrated Circuits group, where he played an integral role in the planning and execution of Microsemi’s transformation to a high value-add integrated circuit supplier.
Since joining Microsemi in 1998, Pickle has held positions of increasing responsibility including corporate vice president of Field Applications Engineering, and senior positions in both sales and marketing/product development. Prior to Microsemi, Pickle’s positions included director of marketing for GMT Microelectronics Corporation, and engineering positions with All American Semiconductor.